ISL9N306AP3 Fairchild Semiconductor, ISL9N306AP3 Datasheet

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ISL9N306AP3

Manufacturer Part Number
ISL9N306AP3
Description
N-channel Logic Level PWM Optimized UltraFET Trench Power MOSFETs
Manufacturer
Fairchild Semiconductor
Datasheet

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Part Number:
ISL9N306AP3
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©2002 Fairchild Semiconductor Corporation
ISL9N306AP3/ISL9N306AS3ST
N-Channel Logic Level PWM Optimized UltraFET® Trench Power MOSFETs
General Description
This device employs a new advanced trench MOSFET
technology and features low gate charge while maintaining
low on-resistance.
Optimized for switching applications, this device improves
the overall efficiency of DC/DC converters and allows
operation to higher switching frequencies.
Applications
• DC/DC converters
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
V
V
I
P
T
R
R
R
D
Device Marking
DSS
GS
D
J
Symbol
, T
JC
JA
JA
STG
N306AS
N306AP
GATE
SOURCE
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Continuous (T
Continuous (T
Continuous (T
Pulsed
Power dissipation
Derate above 25
Operating and Storage Temperature
Thermal Resistance Junction to Case TO-220, TO-263
Thermal Resistance Junction to Ambient TO-220, TO-263
Thermal Resistance Junction to Ambient TO-263, 1in
TO-263AB
ISL9N306AS3ST
ISL9N306AP3
Device
(FLANGE)
C
C
C
DRAIN
= 25
= 100
= 25
o
C
o
o
C, V
C, V
o
C, V
GS
GS
GS
= 10V)
= V, R
Parameter
T
= 4.5V)
TO-263AB
TO-220AB
A
Package
= 25°C unless otherwise noted
JC
= 43
TO-220AB
o
(FLANGE)
C/W)
DRAIN
Features
• Fast switching
• r
• r
• Q
• Q
• C
SOURCE
Reel Size
DS(ON)
DS(ON)
2
330mm
ISS
g
gd
Tube
copper pad area
(Typ) = 30nC, V
DRAIN
(Typ) = 11nC
(Typ) = 3400pF
GATE
= 0.0052
= 0.0085
(Typ), V
(Typ), V
GS
Tape Width
24mm
= 5V
N/A
GS
GS
-55 to 175
Ratings
Figure 4
= 10V
= 4.5V
0.83
G
125
1.2
30
75
61
18
62
43
20
D
S
February 2002
Quantity
800 units
50 units
Rev. B, February 2002
o
o
o
Units
C/W
C/W
C/W
W/
o
W
V
V
A
A
A
A
C
o
C

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ISL9N306AP3 Summary of contents

Page 1

... JC R Thermal Resistance Junction to Ambient TO-220, TO-263 JA R Thermal Resistance Junction to Ambient TO-263, 1in JA Package Marking and Ordering Information Device Marking Device N306AS ISL9N306AS3ST N306AP ISL9N306AP3 ©2002 Fairchild Semiconductor Corporation Features • Fast switching • 0.0052 DS(ON) • 0.0085 DS(ON) • Q (Typ) = 30nC • ...

Page 2

... Turn-Off Time OFF Unclamped Inductive Switching t Avalanche Time AV Drain-Source Diode Characteristics V Source to Drain Diode Voltage SD t Reverse Recovery Time rr Q Reverse Recovered Charge RR ©2002 Fairchild Semiconductor Corporation T = 25°C unless otherwise noted A Test Conditions I = 250 25V ...

Page 3

... Figure 3. Normalized Maximum Transient Thermal Impedance 2000 1000 V = 10V 100 TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION ©2002 Fairchild Semiconductor Corporation 150 175 125 Figure 2. Maximum Continuous Drain Current RECTANGULAR PULSE DURATION (s) ...

Page 4

... V , GATE TO SOURCE VOLTAGE (V) GS Figure 7. Drain to Source On Resistance vs Gate Voltage and Drain Current 1.4 1.0 0.6 0.2 -80 - JUNCTION TEMPERATURE ( J Figure 9. Normalized Gate Threshold Voltage vs Junction Temperature ©2002 Fairchild Semiconductor Corporation (Continued) 150 T 100 - Figure 6. Saturation Characteristics 2 1.5 1.0 ...

Page 5

... R , GATE TO SOURCE RESISTANCE ( ) GS Figure 13. Switching Time vs Gate Resistance Test Circuits and Waveforms VARY t TO OBTAIN P R REQUIRED PEAK Figure 15. Unclamped Energy Test Circuit ©2002 Fairchild Semiconductor Corporation (Continued OSS Figure 12 ...

Page 6

... Test Circuits and Waveforms g(REF) Figure 17. Gate Charge Test Circuit Figure 19. Switching Time Test Circuit ©2002 Fairchild Semiconductor Corporation (Continued DUT g(REF) 0 Figure 18. Gate Charge Waveforms d(ON) ...

Page 7

... JA times a coefficient added to a constant. The area, in square inches is the top copper area including the gate and source pads. 19.84 26.51 + ------------------------------------ - 0.262 + A rea ©2002 Fairchild Semiconductor Corporation , and the application’s ambient never exceeded (EQ ...

Page 8

... S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 0.2 VOFF= -0.3) .ENDS NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley. ©2002 Fairchild Semiconductor Corporation DPLCAP 5 10 RSLC1 ...

Page 9

... Fairchild Semiconductor Corporation DPLCAP 10 RSLC2 - 6 ESG 8 EVTHRES + ...

Page 10

... Fairchild Semiconductor Corporation JUNCTION th RTHERM1 CTHERM1 6 RTHERM2 CTHERM2 5 RTHERM3 CTHERM3 4 RTHERM4 CTHERM4 3 RTHERM5 ...

Page 11

... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ FAST Bottomless™ FASTr™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DenseTrench™ ...

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