MP3H6115A Freescale Semiconductor, Inc, MP3H6115A Datasheet
MP3H6115A
Related parts for MP3H6115A
MP3H6115A Summary of contents
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... On-Chip Signal Conditioned, Temperature Compensated and Calibrated Freescale's MP3H6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer ...
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... Storage Temperature Operating Temperature Output Source Current @ Full Scale Output Output Sink Current @ Minimum Pressure Offset 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from V MP3H6115A Thin Film Gain Stage #2 ...
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... FSO (0 to 85°C) V 2.660 FSS (0 to 85°C) — — V/P — t — R — — — — Typ Max Unit — 115 kPa 3.0 3.3 Vdc 4.0 8.0 mAdc 0.12 0.161 Vdc 2.82 2.861 Vdc 2.70 2.741 Vdc — %V ±1.5 FSS 27 — mV/kPa 1.0 — — ms — %V ±0.25 FSS MP3H6115A 3 ...
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... Min Pressure (Reference to Sealed Vacuum) in kPa Figure 4. Output versus Pressure Differential be transmitted to the silicon diaphragm. The MP3H6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability ...
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... Transfer Function (MP3H6115A) Normal Transfer Value: V OUT ± (Pressure Error x Temp. Factor x 0.009 3.0 ± 0 Temperature Error Band 4.0 3.0 Temperature 2.0 Error Factor 1.0 0.0 -40 NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C Pressure Error Band 3 ...
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... With the correct pad geometry, the packages will self-align when subjected to a Figure 5. SSOP Footprint (Case 1317 and 1317A) MP3H6115A 6 solder reflow process always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE PAGE MP3H6115A 7 ...
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... MP3H6115A 8 PACKAGE DIMENSIONS CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE PAGE MP3H6115A 9 ...
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... MP3H6115A 10 PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE PAGE MP3H6115A 11 ...
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... Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MP3H6115A Rev. 3 11/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...