MP3H6115A Freescale Semiconductor, Inc, MP3H6115A Datasheet - Page 6

• Manufacturer Part Number: MP3H6115A
• Description: High Temperature Accuracy Integrated Silicon Pressure Sensor For Measuring Absolute Pressure, On-chip Signal Conditioned, Temperature Compensated And Calibrated
• Manufacturer: Freescale Semiconductor, Inc

design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
MP3H6115A
6
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Figure 5. SSOP Footprint (Case 1317 and 1317A)
0.150
3.81
0.050
1.27
TYP
0.053 TYP 8X
1.35
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.387
9.83
0.027 TYP 8X
0.69
inch
mm
Freescale Semiconductor
Sensors