MCR08B ON, MCR08B Datasheet
MCR08B
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MCR08B Summary of contents
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... Sensitive Gate Trigger Current Blocking Voltage to 600 Volts Glass Passivated Surface for Reliability and Uniformity Surface Mount Package Device Marking: MCR08BT1: CR08B; MCR08MT1: CR08M, and Date Code MAXIMUM RATINGS ( unless otherwise noted) Rating Peak Repetitive Off– ...
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... Critical Rate-of-Rise of Off State Voltage ( Rated V DRM , 110 1000 , Exponential Method) (1) Pulse Test: Pulse Width 300 s, Duty Cycle ( 1000 is included in measurement. ( not included in measurement. MCR08B, MCR08M Symbol Symbol I DRM , I RRM ...
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... Figure 1. PCB for Thermal Impedance and Power Testing of SOT-223 MCR08B, MCR08M + Current on state I RRM at V RRM Reverse Blocking Region (off state) Reverse Avalanche Region Anode – 0.244 6.2 inches BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR. mm BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL. ...
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... CONDUCTION ANGLE 50 0 0.1 0.2 0.3 I T(AV) , AVERAGE ON-STATE CURRENT (AMPS) Figure 6. Current Derating, 2.0 cm Square Pad Reference: Ambient Temperature MCR08B, MCR08M 160 150 TYPICAL 140 MAXIMUM 130 DEVICE MOUNTED ON 120 FIGURE 1 AREA = L 2 110 PCB WITH TAB AREA 100 AS SHOWN ...
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... JUNCTION TEMPERATURE Figure 10. Typical Gate Trigger Voltage versus Junction Temperature 0.7 0.65 0.6 0.55 0.5 0.45 0.4 0.35 0.3 0.1 1 GATE TRIGGER CURRENT ( A) Figure 12. Typical Range versus Measured I GT MCR08B, MCR08M 1.0 0.1 dc 180 0.01 0.0001 0.001 0.01 0.4 0.5 Figure 9. Thermal Response Device Mounted on Figure 1 Printed Circuit Board 2.0 1 110 –40 –20 ...
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... GATE-CATHODE RESISTANCE (OHMS) Figure 16. Exponential Static dv/dt versus Peak Voltage and Gate-Cathode Termination Resistance 10000 1000 500 100 50 10 5.0 1.0 10 Figure 18. Exponential Static dv/dt versus Gate-Cathode Termination Resistance and MCR08B, MCR08M 10000 5000 1000 500 100 50 10 5.0 1.0 0.5 0.1 10,000 ...
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... A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass MCR08B, MCR08M interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process ...
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... C 100 TIME ( MINUTES TOTAL) Figure 19. Typical Solder Heating Profile MCR08B, MCR08M SOLDERING PRECAUTIONS The soldering temperature and time should not exceed 260 C for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient should less. ...
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... MCR08B, MCR08M PACKAGE DIMENSIONS 0.08 (0003) H SOT–223 CASE 318E–04 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM MIN A 0.249 B 0.130 C 0.060 D 0.024 F 0.115 G 0.087 H 0.0008 J 0.009 J K 0.060 L 0.033 ...
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... Notes MCR08B, MCR08M http://onsemi.com 10 ...
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... Notes MCR08B, MCR08M http://onsemi.com 11 ...
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... English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time) Email: ONlit@hibbertco.com EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781 *Available from Germany, France, Italy, England, Ireland MCR08B, MCR08M CENTRAL/SOUTH AMERICA: Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST) Email: ONlit–spanish@hibbertco.com ASIA/PACIFIC: LDC for ON Semiconductor – ...