MCP23S08/S Microchip Technology, MCP23S08/S Datasheet - Page 36

• Manufacturer Part Number: MCP23S08/S
• Description: 8-bit Input/Output Expander, SPI interface, 0C to +70C, Die-Waffle, WPAC
• Manufacturer: Microchip Technology

MCP23008/MCP23S08
DS21919E-page 36
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
A1
2
1
EXPOSED
A
E
Units
PAD
NOTE 1
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
1
2
MIN
0.80
0.00
2.60
2.60
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.50 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.70
2.70
0.25
0.40
20
–
Microchip Technology Drawing C04-126B
D2
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
2.80
2.80
0.30
0.50
–
L
b
K
e