MCP23S08/S Microchip Technology, MCP23S08/S Datasheet - Page 39

• Manufacturer Part Number: MCP23S08/S
• Description: 8-bit Input/Output Expander, SPI interface, 0C to +70C, Die-Waffle, WPAC
• Manufacturer: Microchip Technology

APPENDIX A:
Revision E (August 2007)
1.
Revision D (February 2007)
1.
2.
3.
4.
Revision C (October 2006)
1.
2.
Revision B (February 2005)
The following is the list of modifications:
1.
2.
Revision A (December 2004)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
Section 3.0
Updated package outline drawings.
Changed
Figure 1-1 from “R” to “W”.
Table 2-4, Param No. 51 and 53: Changed from
450 to 600 and 500 to 600, respecively.
Added disclaimer to package outline drawings.
Updated package outline drawings.
Added
throughout document.
Added disclaimer to package outline drawings.
Section 1.6 “Configuration and Control Reg-
isters”. Added Hardware Address Enable
(HAEN) bit to Table 1-3.
Section 1.6.6 “Configuration (IOCON) Regis-
ter”. Added Hardware Address Enable (HAEN)
bit to Register 1-6.
20-pin
Byte
“Packaging
QFN
REVISION HISTORY
and
Sequential
package
Information”:
information
Read
in
MCP23008/MCP23S08
DS21919E-page 39