MCP23S08/S Microchip Technology, MCP23S08/S Datasheet - Page 41

• Manufacturer Part Number: MCP23S08/S
• Description: 8-bit Input/Output Expander, SPI interface, 0C to +70C, Die-Waffle, WPAC
• Manufacturer: Microchip Technology

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2007 Microchip Technology Inc.
PART NO.
Device
Temperature
Range
Package
Device
Temperature
–
Range
MCP23008T:
MCP23S08:
MCP23S08T:
E
* While these devices are only offered in the “E”
temperature range, the device will operate at different
voltages and temperatures as identified in the
Section 2.0 “Electrical Characteristics”.
ML
P
SO
SS
MCP23008:
X
=
=
=
=
=
Plastic Quad Flat, No Lead Package
Plastic DIP (300 mil Body), 18-Lead
Plastic SOIC (300 mil Body), 18-Lead
SSOP, (209 mil Body, 5.30 mm), 20-Lead
Package
-40°C to +125°C (Extended) *
4x4x0.9 mm Body (QFN), 20-Lead
/XX
8-Bit I/O Expander w/ I
8-Bit I/O Expander w/ I
(Tape and Reel)
8-Bit I/O Expander w/ SPI Interface
8-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
2
2
C™ Interface
C Interface
MCP23008/MCP23S08
Examples:
a)
b)
c)
d)
e)
f)
a)
b)
c)
d)
e)
f)
MCP23008-E/P:
MCP23008-E/SO: Extended Temp.,
MCP23008T-E/SO: Tape and Reel,
MCP23008-E/SS:
MCP23008T-E/SS: Tape and Reel,
MCP23008-E/ML:
MCP23S08-E/P:
MCP23S08-E/SO: Extended Temp.,
MCP23S08T-E/SO: Tape and Reel,
MCP23S08-E/SS: Extended Temp.,
MCP23S08T-E/SS: Tape and Reel,
MCP23S08T-E/MF: Tape and Reel,
.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD QFN package.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD QFN package.
DS21919E-page 41