MC33926 Freescale Semiconductor, MC33926 Datasheet - Page 6

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MC33926

Manufacturer Part Number
MC33926
Description
5.0 A Throttle Control H-Bridge
Manufacturer
Freescale Semiconductor
Datasheet

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Table 2. Maximum Ratings (continued)
permanent damage to the device. These parameters are not production tested.
6
33926
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Notes
Peak Package Reflow Temperature During Reflow
Approximate Junction-to-Board Thermal Resistance
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
7.
8.
9.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
values will vary depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum
die temperature represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
< 5.0°C/W for maximum current at 70°C ambient. Module thermal design must be planned accordingly.
Ratings
(7)
(9)
,
(8)
Symbol
T
R
PPRT
θJB
Analog Integrated Circuit Device Data
Value
< 1.0
250
Freescale Semiconductor
θJB
(junction-to-PC board)
θJA
must be
°
Unit
C/W
°C

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