MMFT1N10 Motorola, MMFT1N10 Datasheet
MMFT1N10
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MMFT1N10 Summary of contents
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... The Formed Leads Absorb Thermal Stress During Sol- dering, Eliminating the Possibility of Damage to the Die Available Tape and Reel Use MMFT1N10ET1 to order the 7 inch/1000 unit reel. Use MMFT1N10ET3 to order the 13 inch/4000 unit reel. MAXIMUM RATINGS ( unless otherwise noted) Rating Drain– ...
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... MMFT1N10E ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage 250 A) Zero Gate Voltage Drain Current 100 Gate–Body Leakage Current CHARACTERISTICS Gate Threshold Voltage mA) Static Drain– ...
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... Figure 4. On–Resistance versus Drain Current 0 0.4 0.3 0.2 0 – 50 Figure 6. On–Resistance versus Junction MMFT1N10E 1 100 150 JUNCTION TEMP ( C) With Temperature 100 – DRAIN CURRENT (AMPS ...
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... MMFT1N10E FORWARD BIASED SAFE OPERATING AREA The FBSOA curves define the maximum drain–to–source voltage and drain current that a device can safely handle when it is forward biased, or when it is on, or being turned on. Because these curves include the limitations of simultaneous high voltage and high current the rating of the device, they are especially useful to designers of linear systems ...
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... STRESS AREA Figure 9. Commutating Waveforms – 120 140 Figure 11. Commutating Safe Operating Area BV DSS Figure 13. Unclamped Inductive Switching MMFT1N10E R GS DUT – 80% OF RATED V DSS V dsL = /dt Test Circuit ...
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... MMFT1N10E 1400 1200 1000 800 600 400 200 Figure 15. Gate Charge versus Gate–To–Source Voltage iss C oss C rss C rss GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 14. Capacitance Variation With Voltage ...
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... Area for the SOT–223 Package (Typical) Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MMFT1N10E 0.8 Watts 1.25 Watts* 1.5 Watts ...
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... MMFT1N10E Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure ...
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... H Motorola TMOS Power MOSFET Transistor Device Data PACKAGE DIMENSIONS CASE 318E–04 TO–261AA SOT–223 ISSUE H MMFT1N10E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.249 0.263 6 ...
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... JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 *MMFT1N10E/D* Motorola TMOS Power MOSFET Transistor Device Data MMFT1N10E/D ...