dsPIC33FJ32MC204 Microchip Technology, dsPIC33FJ32MC204 Datasheet - Page 280

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dsPIC33FJ32MC204

Manufacturer Part Number
dsPIC33FJ32MC204
Description
(dsPIC33FJ16MC304 / dsPIC33FJ32MC20x) 16-bit Microcontrollers
Manufacturer
Microchip Technology
Datasheet

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DS70283B-page 278
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
Preliminary
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
D
A
E
K
e
b
L
E2
1
2
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.30
0.55
28
D2
Microchip Technology Drawing C04-105B
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
4.20
4.20
0.35
0.70
L
b
K
e

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