UPD160062 NEC, UPD160062 Datasheet - Page 17

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UPD160062

Manufacturer Part Number
UPD160062
Description
420-OUTPUT TFT-LCD SOURCE DRIVER
Manufacturer
NEC
Datasheet
11. RECOMMENDED MOUNTING CONDITIONS
(http://www.necel.com/pkg/en/mount/index.html).
different conditions.
µ
Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF
The following conditions must be met for soldering conditions of the
For more details, refer to the Semiconductor Device Mount Manual
Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under
Thermocompression
PD160062N-×××: TCP (TAB package)
Mounting Condition
manufacturing company. Be sure to avoid using two or more packaging methods at a time.
Soldering
ACF
(Adhesive Conductive
Film)
Mounting Method
Data Sheet S16449EJ1V0DS
Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100g (per
solder)
Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm
Real bonding 165 to 180°C, pressure 25 to 45 kg/cm
(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo
Bakelite, Ltd.)
µ
PD160062.
Condition
2
, time 30 to 40 seconds.
2
, time 3 to 5 seconds.
www.DataSheet4U.com
µ
PD160062
17

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