UPD75P216ACW NEC, UPD75P216ACW Datasheet - Page 23

• Manufacturer Part Number: UPD75P216ACW
• Description: 4-BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC

6. RECOMMENDED SOLDERING CONDITIONS
MANUAL” (IEI-1207).
done under different conditions.
Caution This wave soldering should be applied only to lead part, and don’t jet molten solder on the surface
The following conditions must be met when soldering this product.
For more details, refer to our document “SEMICONDUCTOR
Please consult with our sales offices in case other soldering process is used, or in case other soldering is
PD75P216ACW: 64-pin plastic shrink DIP (750 mil)
Wave soldering
(only lead part)
Partial heating
method
Soldering process
of package.
Solder temperature: 260 C or lower,
Flow time: 10 seconds or less
Pin temperature: 260 C or lower,
Time: 10 seconds or less
Table 6-1 Type of Through Hole Device
Soldering conditions
DEVICE
MOUNTING
PD75P216A
TECHNOLOGY
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