AN1902 Freescale Semiconductor / Motorola, AN1902 Datasheet - Page 21

• Manufacturer Part Number: AN1902
• Description: Quad Flat Pack No-Lead (QFN)
• Manufacturer: Freescale Semiconductor / Motorola

Freescale Semiconductor, Inc.
AN1902/D
In situations where neighboring parts are at close proximity with the QFN components
and the mini-stencil method is not an option, apply solder paste carefully on each pad
using a syringe. The volume of solder paste will be difficult to control.
5.3.4 Component Placement
A vacuum nozzle is used to pick the new package up. The split light system displays
images of both the QFN leads and the footprint on the PCB. The two superimposed
images are aligned manually by adjusting the XY table. Once the PCB and the pack-
age are aligned, the package is placed down on the PCB (See
Figure
26).
PCB Image Capture by Camera
Superimpose QFN on PCB
Figure 26 Component Placement Process
5.3.5 Reflow Soldering
The replaced component is then soldered to the PCB using a temperature profile sim-
ilar to the normal reflow soldering process.
MOTOROLA
Quad Flat Pack No-Lead (QFN)
21
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