AN1902 Freescale Semiconductor / Motorola, AN1902 Datasheet - Page 27

• Manufacturer Part Number: AN1902
• Description: Quad Flat Pack No-Lead (QFN)
• Manufacturer: Freescale Semiconductor / Motorola

9.0 ELECTRICAL PERFORMANCE
MOTOROLA
Notes:
As a leadless package, the series inductance and capacitance contributed by the QFN
terminals are lower than those of leaded packages such as the TQFP and TSSOP,
and those of BGA packages (due to the parasitic effects contributed by the substrate
traces). This reduction in parasitic effects gives the QFN package a significant advan-
tage over these other packages for RF applications. It is important to note, however,
that the RLC (RLC stands for resistance, Inductance and capacitance) performance
comprises contributions of both the terminal and bonding wire. In cases of small die to
3. Per JEDEC JESD51-6 with the board horizontal. Board conforms to JEDEC EIA/JESD51-5
4. Thermal resistance between the die and the printed circuit board per JEDEC EIA/JESD51-8.
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
2. EDEC EIA/JESD51-2 with the single layer board horizontal. Board conforms to JEDEC
5. Thermal resistance between the die and the exposed pad without thermal grease.
I/O
32
44
44
44
48
48
48
44
44
44
64
64
64
resistance, mounting site (board) temperature, ambient temperature, power dissipation of
other components on the board, and board thermal resistance.
EIA/JESD51-3 and JEDEC EIA/JESD51-5.
and JEDEC EIA/JESD51-7.
Board temperature is measured on the top surface of the board near the package.
Freescale Semiconductor, Inc.
For More Information On This Product,
Body Size
mm x mm
Table 9 Thermal Resistances for Various QFN Packages (Cont.)
7 x 7
7 x 7
7 x 7
7 x 7
7 x 7
7 x 7
7 x 7
9 x 9
9 x 9
9 x 9
9 x 9
9 x 9
9 x 9
Quad Flat Pack No-Lead (QFN)
Go to: www.freescale.com
Pitch
0.65
0.50
0.50
0.50
0.50
0.50
0.50
0.65
0.65
0.65
0.50
0.50
0.50
mm
mm x mm
Flag Size
4.7 x 4.7
5.1 x 5.1
5.1 x 5.1
5.1 x 5.1
5.1 x 5.1
5.1 x 5.1
5.1 x 5.1
6.7 x 6.7
6.7 x 6.7
6.7 x 6.7
7.1 x 7.1
7.1 x 7.1
7.1 x 7.1
2.56 x 2.56
2.56 x 2.56
4.16 x 4.16
4.56 x 4.56
mm x mm
Die Size
4.3 x 4.3
4.2 x 4.2
4.7 x 4.7
4.2 x 4.2
4.7 x 4.7
5.8 x 5.8
6.3 x 6.3
6.2 x 6.2
6.7 x 6.7
R
°C/W
θJA
87
81
76
74
84
79
77
70
67
65
64
61
59
1,2
R
θJMA
°C/W
26
26
24
23
26
24
23
23
21
21
22
21
21
1,3
R
°C/W
θJB
10
10
9
7
7
8
7
7
6
6
7
6
6
AN1902/D
4
R
°C/W
0.9
2.5
1.0
0.8
2.5
1.0
0.8
1.0
0.5
0.4
0.8
0.5
0.4
θJC
5
27