AN1902 Freescale Semiconductor / Motorola, AN1902 Datasheet - Page 3

• Manufacturer Part Number: AN1902
• Description: Quad Flat Pack No-Lead (QFN)
• Manufacturer: Freescale Semiconductor / Motorola

Freescale Semiconductor, Inc.
AN1902/D
Figure 2 General QFN Cross Section
3.3.2 Singulation Method
The main difference in QFN package design is the singulation method. The individu-
ally molded style is called punch singulated QFN, whereas the Molded Array Package
(MAP) style is sawn, similar to wafer sawing. In this section both styles of QFN are
discussed. In subsequent sections, guidelines and information related to specific style
of QFN is stated as such, otherwise the material applies to both QFN styles.
3.3.2.1 MAP QFN: “E” Style
The MAP style QFN package has two types of lead terminal features. The “E” version
follows the JEDEC MO-220 design guideline. The lead extends to the package perim-
eter, where the lead ends are fully exposed to the side of the package (See
Figure
3).
A solder fillet is expected to form and should be visible on the PCB after the solder
reflow process.
Figure 3 MAP QFN "E" Version [2]: Left-Bottom View, Right-Tilted to Show Side
& Bottom Views
MOTOROLA
Quad Flat Pack No-Lead (QFN)
3
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