IDT72V2101L15PF IDT, Integrated Device Technology Inc, IDT72V2101L15PF Datasheet - Page 18

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IDT72V2101L15PF

Manufacturer Part Number
IDT72V2101L15PF
Description
IC FIFO SS 131X18 15NS 64QFP
Manufacturer
IDT, Integrated Device Technology Inc
Series
72Vr
Datasheet

Specifications of IDT72V2101L15PF

Function
Synchronous
Memory Size
2.3K (131 x 18)
Data Rate
67MHz
Access Time
15ns
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
64-TQFP, 64-VQFP
Configuration
Dual
Density
2.25Mb
Access Time (max)
10ns
Word Size
9b
Organization
256Kx9
Sync/async
Synchronous
Expandable
Yes
Bus Direction
Uni-Directional
Package Type
TQFP
Clock Freq (max)
66.7MHz
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.15V
Operating Supply Voltage (max)
3.45V
Supply Current
55mA
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
72V2101L15PF

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT72V2101L15PF
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72V2101L15PF8
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72V2101L15PFI
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72V2101L15PFI8
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
NOTES:
1. t
2. LD = HIGH.
3. First word latency: t
Q
NOTES:
1. t
2. LD = HIGH, OE = LOW, EF = HIGH
Q
D
D
IDT72V2101/72V2111 3.3V HIGH DENSITY CMOS
SUPERSYNC FIFO
WCLK
RCLK
0
0
WCLK
0
0
WEN
of WCLK and the rising edge of RCLK is less than t
RCLK
REN
SKEW1
edge of the RCLK and the rising edge of the WCLK is less than t
- Q
- D
WEN
REN
SKEW1
- D
- Q
OE
EF
n
n
n
n
is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus t
is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go high (after one WCLK cycle pus t
t
ENS
t
DATA IN OUTPUT REGISTER
ENS
SKEW1
TM
t
t
OLZ
t
262,144 x 9, 524,288 x 9
SKEW1
ENH
t
+ 1*T
REF
t
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing (IDT Standard Mode)
A
t
OE
(1)
RCLK
t
SKEW1
+ t
t
t
ENH
ENS
REF
t
DS
t
A
D
(1)
.
1
0
NO WRITE
NO OPERATION
Figure 7. Write Cycle and Full Flag Timing (IDT Standard Mode)
t
t
DHS
ENH
SKEW1
LAST WORD
1
, then EF deassertion may be delayed one extra RCLK cycle.
2
t
SKEW1
WFF
, then the FF deassertion may be delayed one extra WCLK cycle.
t
t
OHZ
t
DS
t
DS
ENS
t
CLKH
D
D
1
NO OPERATION
X
t
WFF
t
t
ENH
DH
DATA READ
18
t
t
DH
CLK
2
t
CLKL
t
CLKH
t
REF
t
ENS
t
OLZ
t
SKEW1
t
CLK
(1)
t
CLKL
t
ENS
t
ENH
LAST WORD
t
A
1
NO WRITE
t
ENH
t
A
COMMERCIAL AND INDUSTRIAL
REF
WFF
2
). If the time between the rising edge
). If the time between the rising
TEMPERATURE RANGES
NEXT DATA READ
t
ENS
t
WFF
t
DS
D
0
D
X
+1
t
REF
t
t
ENH
A
4669 drw 10
t
DH
t
4669 drw 11
WFF
D
1

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