CLA80000 Zarlink Semiconductor, CLA80000 Datasheet - Page 12
![no-image](/images/manufacturer_photos/0/7/727/zarlink_semiconductor_sml.jpg)
CLA80000
Manufacturer Part Number
CLA80000
Description
High Density CMOS Gate Arrays
Manufacturer
Zarlink Semiconductor
Datasheet
1.CLA80000.pdf
(24 pages)
ABSOLUTE MAXIMUM RATINGS
Exceeding the absolute maximum ratings may cause permanent damage to the device. Extended exposure at the
maximum ratings will affect device reliability. HBM stands for Human Body Model.
NORMAL OPERATING CONDITIONS
Neither performance nor reliability is guaranteed outside these limits. Extended operation above these limits may affect
device reliability.
DC ELECTRICAL CHARACTERISTICS
All characteristics are for -55 to150 ° C and 2.7 to 5.5V unless otherwise specified
.
12
Supply Voltage
Input Voltage
Output Voltage
Static discharge voltage (HBM)
Storage Temperature
Ceramic
Plastic
Supply Voltage
Input Voltage
Output Voltage
Current per pad
Junction Temperature
Ambient Temperature
Commercial Grade
Industrial Grade
Military Grade
Operating Power
Input capacitance
Output capacitance
Bidirectional capacitance
Characteristic
PARAMETER
PARAMETER
P
C
C
C
DD
I
OUT
BI
Sym
Min.
Min.
Min.
-0.5
-0.5
-0.5
V
V
-65
-40
2.7
-55
-40
-55
0
SS
SS
Value
Typ.
1.3
4.1
5
6
6
V
V
DD
DD
Max.
Max.
V
V
150
125
100
150
125
7.0
5.5
70
85
4
DD
DD
+0.5
+0.5
Max.
Units
Units
∞°C
∞°C
mA
kV
°C
°C
°C
°C
µW/
MHz
pF
pF
pF
V
V
V
V
V
V
Unit
V
V
Any input, excluding package
Any output, excluding package
Any I/O pin, excluding package
DD
DD
= 3V, for NAND2 with 2 standard loads
= 5V, for NAND2 with 2 standard loads
Conditions