CLA80000 Zarlink Semiconductor, CLA80000 Datasheet - Page 17
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CLA80000
Manufacturer Part Number
CLA80000
Description
High Density CMOS Gate Arrays
Manufacturer
Zarlink Semiconductor
Datasheet
1.CLA80000.pdf
(24 pages)
HIGH DENSITY PAD ARRAY PRODUCTION PACKAGING OPTIONS
F
Q
F
P
Style
Style
Style
M
Q
Q
F
P
L
F
100
208
240
304
Leads
Leads
Leads
100
120
128
144
160
100
44
52
64
64
64
80
80
48
64
80
FQFP100-FP-
1414
FQFP208-FP-
2828
FQFP240-FP-
3232
FQFP304-FP-
4040
MQFP64- GP-
MQFP80-GQ-
LQFP100-FP-
MQFP44-GP-
MQFP52-GP-
MQFP64-GP-
MQFP64-GP-
MQFP80-GP-
LQFP80- GP-
LQFP48-FP-
LQFP64-FP-
MQFP100-
MQFP120-
MQFP128-
MQFP144-
MQFP160-
GP-1420
GP-2828
GP-2828
GP-2828
GP-2828
Code
Code
Code
1010
1010
1420
1414
1414
1420
1414
0707
1010
1414
1414
0.50
0.50
0.50
0.50
Pitch
Pitch
Pitch
0.80
0.65
1.00
0.80
0.80
0.80
0.65
0.65
0.80
0.80
0.65
0.65
0.50
0.50
0.65
0.50
2.0
3.4
3.4
3.8
Height
Height
Height
2.0
2.0
2.8
2.8
2.0
2.8
2.0
2.8
3.4
3.4
3.4
3.4
1.4
1.4
1.4
1.4
Metric Quad Flat Pack - plastic.
1810
LQFP (Low profile) - plastic.
1835^
2172^
1807^
2168^
FQFP (Fine Pitch) - plastic.
2152
1710
1755
2157
2166
2130
1889
1887
81
81
81
1810
1835^
2172^
1730^
2100^
2159^
2168^
2152
1710
1755
2157
1807
2166
2130
1889
1887
82
82
82
1810
1835^
2172^
2159^
1882^
2152
1710
1755
2157
1807
2166
1899
2100
2130
1889
1887
83
83
83
2156
2160^
1882^
2130^
2152
1710
1755
1835
2172
2157
1807
2158
1899
2100
2159
1889
1888
84
84
84
2156
2160^
1710^
1882^
2130^
1755
2172
2157
1807
2158
1899
2100
2159
1889
1888
85
85
85
2156^
2160^
2172
1808
2158
1899
2100
2159
1882
1888
86
86
86
2160
2163^
1713^
1732
1882
87
87
87
2163
1880^
2118^
88
88
88
17
89
89
89