SG175 Motorola / Freescale Semiconductor, SG175 Datasheet - Page 3

• Manufacturer Part Number: SG175
• Description: 68K-ColdFire Product Selector Guide Networking Systems Division 1st Quarter 2000
• Manufacturer: Motorola / Freescale Semiconductor

PowerPC, ColdFire and 68K CPUs and Integrated Processors
100, 600, and 700 Series PowerPC Processors & Chipsets
MPC823 Integrated PowerPC Microprocessors for Portable Systems
MPC850 and MPC860 Integrated PowerPC Communications Processors
106
EC603e
603e
740/750
7400
823
850
855
860 rev. B-C
Device No.
MPC106A
MPC106A
MPC106A
KMPE603E
MPE603E
MPE603E
MPE603R
KMPC603E
MPC603E
MPC603E
MPC603E
MPC603E
MPC603R
MPC603R
MPC740A
MPC740A
MPC750A
MPC750A
XPC740P
XPC750P
XPC750P
XPC750P
XPC7400
XPC7400
KMPC/KXPC = Sample
Device No.
XPC823
XPC823
XPC823E
Device No.
XPC850
XPC850DE
XPC850SR
XPC855T
XPC855T
XPC860
XPC860DC
XPC860DE
XPC860DH
XPC860DT
XPC860EN
XPC860MH
XPC860SR
XPC860T
Package
304-Lead RX
304-Lead RX
304-Lead RX
240-Lead FE
240-Lead FE
255-Lead RX
255-Lead RX
240-Lead FE
240-Lead FE
240-Lead FE
255-Lead RX
255-Lead RX
255-Lead RX
255-Lead RX
255-Lead RX
255-Lead RX
360-Lead RX
360-Lead RX
255-Lead RX
360-Lead RX
360-Lead RX
360-Lead RX
360-Lead RX
360-Lead RX
Package
256-Lead ZT
256-Lead ZT
256-Lead ZT
357-Lead ZP
357-Lead ZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
357-Lead ZPZP
Package
256-Lead ZT
256-Lead ZC
256-Lead ZT
Speeds
66
83
66, 83
100, 133
100, 133
100, 133
200, 266, 300
100, 133
100, 133
100, 133
100, 133
100, 133
200, 266, 300
200, 266
200, 233, 266
200, 266
200, 233, 266
200, 266
300, 333
300, 333
400
366
350, 400, 450, 500
350, 400
Speeds
66, 75, 81
66, 75, 81
66, 75
Speeds
50, 66, 80
50, 66, 80
50, 66, 80
50, 66
80
33, 50, 66
33, 50, 66
33, 50, 66
33, 50, 66
50
33, 50, 66
33, 50, 66
33, 50, 66
33, 50
Rev
B
B
B
D3
D3
C. 1
C. 1
C. 1
C. 1
B.3/B.5
C. 1
C. 1
C. 1
B.3/B.5
B2
B2
B2
Apps mods: T = -40°C to 105°C Tj; N = 65°C; P = 65°C; R = 105°C
Apps
Modr
C
D
T
L
L
L
L
L
L
T
L
T
L
T
L
T
L
T
L
L
P
R
P
L
Rev
Device Name
Portable
System MPU
Device Name
Low-Cost
Integrated
PowerPC MPU
Low-Cost
Integrated
PowerPC MPU
PowerQUICC™
PowerPC MPU
Rev
G=4.0
G=4.0
G=4.0
N=4. 1
N=4. 1
N=4. 1
C=2. 1
N=4. 1
N=4. 1
N=4. 1
N=4. 1
N=4. 1
C=2. 1
C=2. 1
H=3. 1
H=3. 1
H=3. 1
H=3. 1
E=1.2
E=1.2
E=1.2
E=1.2
K=2.9
K=2.9
Process
HiP 1.4
HiP 1.4
HiP 1.4
HiP 1.3
HiP 1.3
HiP 1.3
HiP 3.0
HiP 1.3
HiP 1.3
HiP 1.3
HiP 1.3
HiP 1.3
HiP 3.0
HiP 3.0
HiP 3.0
HiP 3.0
HiP 3.0
HiP 3.0
HiP 3.5
HiP 3.5
HiP 3.5
HiP 3.5
HiP 5.6
HiP 5.6
Temp
CZT 66
CZC 66
CZT 66
Temp**
(-40 to
+85 C)
CZT50
—
TBD
CZP50, 66
—
CZP 33, 50
CZP 33, 50
CZP 33, 50
CZP 33, 50
CZP 50
CZP 33, 50
CZP 33, 50
CZP 33, 50
CZP 33, 50
Voltage
Core
3.3±5%
3.3±5%
3.3±5%
3.3±5%
3.3±5%
3.3±5%
2.5±5%
3.3±5%
3.3±5%
3.3±5%
3.3±5%
3.3±5%
2.5±5%
2.5±5%
2.6±0. 1
2.6±0. 1
2.6±0. 1
2.6±0. 1
1.9±0. 1
1.9±0. 1
2.05±0.05
2.05±0.05
2. 1 5±0.05
1.8±0. 1
3
Standard temp: 0° to +105°C Tj (junction temperature)
Voltage
IO/tol.
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3/5.0
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
For sample order—KXPC823ZT81B2, KXPC823ZC81B2, KXPC823EZT75B2
SOQ
SOQ
For sample order—KXPC850SRZT80B
For sample order—KXPC855TZP66D3, KXPC855TZP80D3
For sample order—KXPC860, KXPC860DC, KXPC860DE, KXPC860DH, KXPC860DP ,
KXPC860DT, KXPC860EN, KXPC860MH, KXPC860P , KXPC86SR, KXPC860T.
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
MPQ
MPQ
44
44
44
44
44
44
44
44
44
44
44
60
60
60
60
90
60
SOQ
1
1
0
2
0
1
1
2
0
0
1
0
1
1
1
0
1
0
1
1
1
1
1
1
POQ
300
300
300
220
220
220
220
220
220
220
220
220
220
220
POQ
300
420
300
Standard temp: 0° to +95°C Tj (junction temperature)
MPQ
1
1
4
2
24
1
1
2
24
24
1
60
1
1
1
60
1
44
1
1
1
1
1
1
BRICK
Description
PowerPC MPU for mobile computing.
POQ
55
55
55
2
24
60
60
2
24
24
60
60
60
60
60
60
44
44
60
44
44
44
44
44
Description
Low cost, integrated PowerPC MPU with tailored
Communication Processing Module (CPM) including Uni-
versal Serial Bus (USB).
Low cost, integrated PowerPC MPU with tailored
Communication Processing Module (CPM) including Fast
Ethernet.
PowerQUICC family with embedded PowerPC superscalar
MPU —with 4KB I-cache, 4 KB D-cache, and MMUs inte-
grated with Communication Processing Module (CPM) of
earlier generation 68360 QUICC.™
32-bit PowerPC superscalar MPU (3 instructions per
cycle) with dual 16k instruction and data caches, 32-
and 64-bit external data bus, 2.5- or 3.3-volt core and
3.3-volt I/O. (N
Description
60x to PCI bridge, multiple-processor support, L2
cache controller, memory controller with support for
EDO/FPM, DRAM, SDRAM, ROM, and flash ROM.
32-bit PowerPC superscalar MPU (3 instructions per
cycle) with dual 16k instruction and data caches, sin-
gle/double precision IEEE FPU, 32- and 64-bit exter-
nal data bus, 2.5- or 3.3-volt core and 3.3-volt I/O.
32-bit PowerPC superscalar MPU (3 instructions per
cycle) with dual 32k instruction and data caches, sin-
gle/double precision IEEE FPU, and 64-bit external
data bus. The PowerPC 750 also has external L2
cache interface (up to 1 meg) with integrated con-
troller and cache tags.
32-bit PowerPC superscalar MPU (3 instructions per
cycle) combined with 128-bit AltiVec technology
vector processing implementation, dual 32k instruc-
tion and data caches, single/double precision IEEE
FPU, and 64-bit external data bus and 32-bit address
bus. The MPC 7400 also has external L2 cache
interface (up to 2 MB) with integrated controller and
cache tags.
ot recommended for new designs.)