LTC2245 Linear Technology, LTC2245 Datasheet - Page 19

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LTC2245

Manufacturer Part Number
LTC2245
Description
10Msps Low Power 3V ADC
Manufacturer
Linear Technology
Datasheet

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PACKAGE DESCRIPTIO
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PIN 1
TOP MARK
(NOTE 6)
5.00 ± 0.10
(4 SIDES)
U
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
0.50 BSC
0.25 ± 0.05
UH Package
0.70 ±0.05
PACKAGE OUTLINE
0.75 ± 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
3.45 ± 0.10
(4-SIDES)
0.00 – 0.05
0.200 REF
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31
0.50 BSC
0.25 ± 0.05
32
LTC2245
(4 SIDES)
0.23 TYP
1
2
(UH) QFN 0603
0.40 ± 0.10
19
2245fa

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