LTC3529 Linear Dimensions Semiconductor, LTC3529 Datasheet - Page 11

• Manufacturer Part Number: LTC3529
• Description: 1.5MHz Step-Up dc
• Manufacturer: Linear Dimensions Semiconductor

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PACKAGE DESCRIPTION
3.50 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
2.10 ±0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.200 REF
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
2.00 ±0.10
1.35 ±0.05
(2 SIDES)
1.35 REF
1.65 ± 0.05
(Reference LTC DWG # 05-08-1718 Rev A)
8-Lead Plastic DFN (2mm × 3mm)
0.45 BSC
0.75 ±0.05
0.70 ±0.05
0.25 ± 0.05
3.00 ±0.10
(2 SIDES)
DCB Package
PACKAGE
OUTLINE
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
4
TYP
5
1.65 ± 0.10
1.35 ±0.10
1.35 REF
8
0.45 BSC
0.40 ± 0.10
1
(DCB8) DFN 0106 REV A
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.23 ± 0.05
LTC3529
11
3529fa