LTC3555 Linear Technology, LTC3555 Datasheet - Page 31

• Manufacturer Part Number: LTC3555
• Description: High Efficiency USB Power Manager + Triple Step-Down DC/DC
• Manufacturer: Linear Technology

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PACKAGE DESCRIPTION
4.50 ± 0.05
3.10 ± 0.05
2.50 REF
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.65 ± 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
PIN 1
TOP MARK
(NOTE 6)
0.25 ±0.05
3.65 ± 0.05
4.10 ± 0.05
5.50 ± 0.05
4.00 ± 0.10
(2 SIDES)
3.50 REF
(Reference LTC DWG # 05-08-1712 Rev B)
28-Lead Plastic QFN (4mm × 5mm)
UFD Package
0.70 ±0.05
0.75 ± 0.05
PACKAGE OUTLINE
0.200 REF
0.00 – 0.05
3.50 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
3.65 ± 0.10
2.65 ± 0.10
R = 0.115
TYP
2.50 REF
27
28
LTC3555
R = 0.20 OR 0.35
× 45° CHAMFER
0.50 BSC
PIN 1 NOTCH
0.25 ± 0.05
(UFD28) QFN 0506 REV B
1
2
0.40 ± 0.10
31
3555f