LTC3835 Linear Technology, LTC3835 Datasheet - Page 27
![no-image](/images/manufacturer_photos/0/3/388/linear_technology_sml.jpg)
LTC3835
Manufacturer Part Number
LTC3835
Description
Low IQ Synchronous Step-Down Controller
Manufacturer
Linear Technology
Datasheet
1.LTC3835.pdf
(28 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC3835EDHC-1
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC3835EDHC-1
Manufacturer:
LTNRAR
Quantity:
20 000
Part Number:
LTC3835EDHC-1#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LTC3835EDHC-1#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC3835EGN-1
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC3835EGN-1
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LTC3835EGN-1#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC3835EUFD
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC3835IDHC-1
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC3835IGN-1
Manufacturer:
LT
Quantity:
10 000
www.datasheet4u.com
PACKAGE DESCRIPTION
4.50 0.05
3.10 0.05
1.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
2.65 0.05
0.50 BSC
0.25 0.05
3.65 0.05
4.10 0.05
5.50 0.05
6.60 0.10
2.50 REF
(.0035 – .0079)
0.09 – 0.20
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 0.10
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
RECOMMENDED SOLDER PAD LAYOUT
(.169 – .177)
4.30 – 4.50*
(.020 – .030)
0.50 – 0.75
SEE NOTE 4
(.152)
MILLIMETERS
3.86
0.70 0.05
(INCHES)
PACKAGE
OUTLINE
0.65 BSC
(Reference LTC DWG # 05-08-1711 Rev B)
20-Lead Plastic QFN (4mm × 5mm)
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
5.00 0.10
(2 SIDES)
0.45 0.05
Exposed Pad Variation CB
(.108)
0.25
REF
2.74
1.05 0.10
0 – 8
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
UFD Package
FOR EXPOSED PAD ATTACHMENT
FE Package
PIN 1
TOP MARK
(NOTE 6)
4.00 0.10
(2 SIDES)
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
TYP
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
(.152)
3.86
0.200 REF
0.00 – 0.05
14 13
0.75 0.05
12
11
FE20 (CB) TSSOP 0204
(.002 – .006)
0.05 – 0.15
2.50 REF
(.108)
(.047)
2.74
1.20
MAX
R = 0.05 TYP
(.252)
6.40
BSC
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
3.65 0.10
2.65 0.10
1.50 REF
LTC3835
19
20
0.50 BSC
0.25 0.05
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
27
(UFD20) QFN 0506 REV B
1
2
0.40 0.10
3835fc