FS612509-02 ETC, FS612509-02 Datasheet - Page 7

• Manufacturer Part Number: FS612509-02
• Description: 1:9 ZERO DELAY CLOCK BUFFER IC
• Manufacturer: ETC

November 2000
6.0
Table 8: 24-pin TSSOP Package Dimensions
Table 9: 24-pin TSSOP Package Characteristics
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
ISO9001
ISO9001
AMERICAN MICROSYSTEMS, INC.
A
A
E
ISO9001
ISO9001
QS9000
QS9000
QS9000
QS9000
A
C
D
E
S
b
e
L
1
2
3
1
2
1
0.0315
0.0075
0.0035
0.0177
0.0079
0.002
0.303
0.169
MIN.
0
-
Package Information
INCHES
12 REF
12 REF
0.0256
0.252
PARAMETER
0.0413
0.0118
0.0079
0.0295
MAX.
0.047
0.006
0.311
0.177
DIMENSIONS
8
-
MILLIMETERS
MIN.
0.05
0.80
0.19
0.09
7.70
4.30
0.45
0.20
0
-
6.40 BSC
0.65 BSC
12 REF
12 REF
MAX.
1.20
0.15
1.05
0.30
0.20
7.90
4.50
0.75
8
-
BASE PLANE
SYMBOL
24
b
1
AMERICAN MICROSYSTEMS, INC.
C
C
C
L
L
L
11
12
13
JA
11
12
13
e
Air flow = 0 m/s
Longest lead
Longest lead to any 1
Longest lead to any 2
Longest lead to V
Longest lead to any 1
Longest lead to any 2
D
7
CONDITIONS/DESCRIPTION
SS
SEATING PLANE
st
nd
st
nd
adjacent lead
adjacent lead
adjacent lead
adjacent lead
1:9 Zero-Delay Clock Buffer IC
1:9 Zero-Delay Clock Buffer IC
1:9 Zero-Delay Clock Buffer IC
1:9 Zero-Delay Clock Buffer IC
A
E
FS612509-01/-02
FS612509-01/-02
FS612509-01/-02
FS612509-01/-02
1
1
E
A
2
A
c
S
L
0.007
TYP.
0.24
1.7
0.6
0.3
0.1
84
UNITS
°C/W
nH
nH
pF
pF