suf-8000 RF Micro Devices, suf-8000 Datasheet - Page 5

• Manufacturer Part Number: suf-8000
• Description: Dc To 12 Ghz, Cascadable Phemt Mmic Amplifier
• Manufacturer: RF Micro Devices

Notes:
1. All dimensions in inches [millimeters].
2. No connection required for unlabeled bond pads.
3. Die thickness is 0.004 [0.10].
4. Typical bond pad is 0.004 [0.10] square.
5. Backside and bond pad metalization is Gold.
6. Backside is ground.
EDS-106167 Rev B
Bottom
Die
Pin
1
2
RFOUT/BIAS
Function
RFIN
GND
Description
This pad is DC coupled and matched to 50 Ω. An external DC block is required.
This pad is DC coupled and matched to 50 Ω. Bias is applied through this pad.
Die bottom must be connected to RF/DC ground using silver-filled conductive epoxy.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
Die Dimensions
SUF-8000
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