si5318 ETC-unknow, si5318 Datasheet - Page 28

• Manufacturer Part Number: si5318
• Description: Sonet/sdh Precision Clock Multiplier
• Manufacturer: ETC-unknow

Si5318
6. 9x9 mm CBGA Card Layout
28
Notes:
Symbol
1. The Placement Courtyard is the minimum keep-out area required to assure assembly clearances.
2. Pad Diameter is Copper Defined (Non-Solder Mask Defined/NSMD).
3. OSP Surface Finish Recommended.
4. Controlling dimension is millimeters.
5. Land Pad Dimensions comply with IPC-SM-782 guidelines.
6. Target solder paste volume per pad is 0.065 mm
7. Recommended stencil type is chemically etched stainless steel with circularly tapered apertures.
C
D
E
F
X
Recommended stencil aperture dimensions to achieve target solder paste volume are 0.191 mm
thick x 0.68±0.01 mm diameter, with a 0.025 mm taper.
Placement Courtyard
Placement Courtyard
Column Width
Pad Diameter
Table 12. Recommended Land Pattern Dimensions
Row Height
Parameter
Pad Pitch
10.00
0.64
Min
—
—
—
Rev. 1.0
3
± 0.010 mm
Dimension
7.00 REF
7.00 REF
1.00 BSC
Nom
0.68
—
3
(4000 mils
Max
0.72
—
—
—
—
3
± 600 mils
3
).
Notes
2, 3
1