mcm63p631 Freescale Semiconductor, Inc, mcm63p631 Datasheet - Page 7

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mcm63p631

Manufacturer Part Number
mcm63p631
Description
64k X 32 Bit Pipelined Burstram Synchronous Fast Static Ram
Manufacturer
Freescale Semiconductor, Inc
Datasheet
NOTES:
NOTES:
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS
Power Supply Voltage
Voltage Relative to V SS for Any
Pin Except V DD
Output Current (per I/O)
Package Power Dissipation
Ambient Temperature
Die Temperature
Temperature Under Bias
Storage Temperature
Junction to Ambient (@ 200 lfm)
Junction to Board (Bottom)
Junction to Case (Top)
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
2. Power dissipation capability is dependent upon package characteristics and use
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
environment. See Package Thermal Characteristics.
temperature, air flow, board population, and board thermal resistance.
1012.1).
Rating
V in , V out
Symbol
(See Note 1)
T bias
Rating
V DD
T stg
I out
P D
T A
T J
– 0.5 to V DD + 0.5
– 0.5 to + 4.6
– 55 to 125
– 10 to 85
0 to 70
Value
110
1.6
20
Single Layer Board
Four Layer Board
Unit
mA
W
V
V
C
C
C
C
Notes
2
2
Symbol
R JC
R JA
R JB
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
This device contains circuitry to protect the
Max
40
25
17
9
Unit
C/W
C/W
C/W
MCM63P631
Notes
1, 2
3
4
7

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