s29al008d Meet Spansion Inc., s29al008d Datasheet - Page 47
![no-image](/images/no-image-200.jpg)
s29al008d
Manufacturer Part Number
s29al008d
Description
8 Megabit 1 M X 8-bit/512 K X 16-bit Cmos 3.0 Volt-only Boot Sector Flash Memory
Manufacturer
Meet Spansion Inc.
Datasheet
1.S29AL008D.pdf
(52 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
s29al008d-70TAI01
Manufacturer:
SPANSIO
Quantity:
3
Company:
Part Number:
s29al008d50BFIE13
Manufacturer:
PANA
Quantity:
995
Company:
Part Number:
s29al008d55TFAR2
Manufacturer:
SPANSION
Quantity:
16 336
Part Number:
s29al008d55TFIR20
Manufacturer:
SPANSION
Quantity:
20 000
Company:
Part Number:
s29al008d70BFI01
Manufacturer:
SPANSION
Quantity:
10 288
Part Number:
s29al008d70BFI020E
Manufacturer:
SPANSION
Quantity:
20 000
Company:
Part Number:
s29al008d70BFIA23E
Manufacturer:
LT
Quantity:
1 322
Part Number:
s29al008d70BFIA23E
Manufacturer:
SPANSLON
Quantity:
20 000
Part Number:
s29al008d70FI02
Manufacturer:
SPANSION
Quantity:
20 000
Part Number:
s29al008d70TF
Manufacturer:
SPANSION
Quantity:
20 000
16.2
November 27, 2007 S29AL008D_00_A10
VBK 048—48 Ball Fine-Pitch Ball Grid Array (FBGA) 8.15 x 6.15 mm
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
A1
A2
D1
ME
E1
fb
A
D
N
E
e
A1
6.15 mm x 8.15 mm NOM
0.18
0.62
0.35
MIN
---
INDEX MARK
10
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
PACKAGE
VBK 048
NOM
N/A
---
---
---
---
---
48
8
6
SEATING PLANE
TOP VIEW
SIDE VIEW
D a t a
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S29AL008D
NOTE
A
0.10
A2
C
(4X)
E
B
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4. e
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
C
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIAMETER IN A PLANE PARALLEL TO DATUM C.
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
f 0.08
f 0.15
fb
REPRESENTS THE SOLDER BALL GRID PITCH.
H
M
M
C
C
G
A
BOTTOM VIEW
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
3338 \ 16-038.25b
SE
A1 CORNER
7
E1
47