mt45w4mw16bcgb Micron Semiconductor Products, mt45w4mw16bcgb Datasheet - Page 69

• Manufacturer Part Number: mt45w4mw16bcgb
• Description: 64mb 4 Meg X 16 Async/page/burst Cellularram 1.5 Memory
• Manufacturer: Micron Semiconductor Products

Package Information
Figure 56:
PDF: 09005aef8247bd51/Source: 09005aef8247bd83
64mb_burst_cr1_5_p25z_133mhz__2.fm - Rev. F 9/07 EN
set forth herein. Although considered final, these specifications are subject to change, as further product development and
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
Solder ball
diameter refers
to post-reflow
condition. The
pre-reflow
diameter is 0.35.
Seating
plane
6.00
0.10 A
54X Ø0.37
Ball A6
3.00
54-Ball VFBGA
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions are in millimeters; MAX/MIN or typical (TYP) where noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W4MW16BCGB uses “green” packaging.
1.875
All other trademarks are the property of their respective owners.
6.00 ±0.10
0.25mm per side.
0.75
TYP
3.75
64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.5 Memory
3.00 ±0.05
data characterization sometimes occur.
0.75 TYP
Ball A1
Ball A1 ID
0.70 ±0.05
69
4.00 ±0.05
®
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
Solder ball material:
Solder ball pad:
Substrate material: plastic laminate
Mold compound: epoxy novolac
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.30 solder mask defined
Package Information
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID