mt45w1mw16pdga Micron Semiconductor Products, mt45w1mw16pdga Datasheet - Page 28

• Manufacturer Part Number: mt45w1mw16pdga
• Description: 16mb 1 Meg X 16 Async/page Cellularram 1.0 Memory
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 24:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron Technology, Inc.
PDF: 09005aef81cadc83/Source:09005aef81c6edb4
16mb_asyncpage_cr1_0_p23z_2.fm - Rev. F 4/08 EN
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production
devices. Although considered final, these specifications are subject to change, as further product development and data characterization
inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of their respective owners.
SEATING
PLANE
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
PRE-REFLOW BALL
DIAMETER IS 0.35
ON A 0.30 SMD
BALL PAD.
0.10 A
5.25
48X Ø0.37
48-Ball VFBGA
BALL A6
2.625
0.70 ±0.05
A
Notes: 1. All dimensions in millimeters, MAX/MIN or typical where noted.
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W1MW16PD uses “green” packaging.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1.875
0.25mm per side.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
16Mb: 1 Meg x 16 Async/Page CellularRAM 1.0 Memory
0.75 TYP
C L
sometimes occur.
4.00 ±0.05
BALL A1
BALL A1 ID
28
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
BALL A1 ID