pcf8814 NXP Semiconductors, pcf8814 Datasheet - Page 60

• Manufacturer Part Number: pcf8814
• Description: Pcf8814 65 X 96 Pixels Matrix Lcd Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
18 CHIP INFORMATION
The PCF8814 is manufactured in n-well CMOS
technology.
The substrate is at V
Table 36 Bonding pad information
2003 Mar 13
handbook, halfpage
Pad pitch
Bump
dimensions
Wafer
thickness
(excl. bumps)
PARAMETER
65
d = 90 m
96 pixels matrix LCD driver
y
Fig.56 Shape of alignment mark.
center
ROWS/COLS
30.04 x 99.00
51.84 (min)
15.0 ( 3)
SS
SIDE
potential.
x
381 ( 25)
center
39.94 x 90.00
INTERFACE
MGU651
15.0 ( 3)
63 (min)
SIDE
d
UNIT
m
m
m
60
handbook, halfpage
handbook, halfpage
60 m square
1.91
mm
Fig.57 Shape of bump alignment mark.
Fig.55 Chip size and pad pitch.
Y center
y
x
PCF8814
10.40 mm
X center
Objective specification
pitch
MBL595
PCF8814
MBL594