tda8769hw/8 NXP Semiconductors, tda8769hw/8 Datasheet - Page 24

• Manufacturer Part Number: tda8769hw/8
• Description: 12-bit, 60/80/105 Msps Analog-to-digital Converter Adc Nyquist/high If Sampling
• Manufacturer: NXP Semiconductors

Philips Semiconductors
12 PACKAGE OUTLINE
2003 Dec 09
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
12-bit, 60/80/105 Msps Analog-to-Digital Converter
(ADC) Nyquist/high IF sampling
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
E h
SOT545-2
max.
1.2
A
37
48
y
0.15
0.05
A 1
36
1
e
1.05
0.95
A 2
exposed die pad side
pin 1 index
0.25
A 3
IEC
b
p
0.27
0.17
b p
H
D h
D
D
0.20
0.09
w
c
M
D
7.1
6.9
JEDEC
(1)
X
D h
4.6
4.4
REFERENCES
Z D
12
25
0
E
7.1
6.9
24
B
13
(1)
Z E
E h
4.6
4.4
JEITA
b
scale
24
e
2.5
w
p
v
v
M
0.5
M
M
e
c
A
A
E
B
9.1
8.9
H D
H
E
5 mm
H E
9.1
8.9
A
A
L
1
2
A
0.75
0.45
1
L p
PROJECTION
0.2
EUROPEAN
v
detail X
0.08
w
0.08
Objective specification
y
Z D
0.89
0.61
ISSUE DATE
L
(1)
TDA8769
L
99-08-04
03-04-07
p
Z E
0.89
0.61
SOT545-2
(1)
(A )
3
7
0