tda8552t NXP Semiconductors, tda8552t Datasheet - Page 5

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tda8552t

Manufacturer Part Number
tda8552t
Description
2 X 1.4 W Btl Audio Amplifiers With Digital Volume Control And Headphone Sensing
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PINNING
Note
1. For the SO20 (SOT163-1) package only: the ground
2002 Jan 04
GND1
OUT2+
V
HPS
MODE
UP/DOWN1
UP/DOWN2
V
OUT2
GND2
GND3
OUT1+
V
GAINSEL
IN2
SVR
IN1
V
OUT1
GND4
DD1
DD2
DD3
DD4
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
SYMBOL
pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.
PIN
10
11
12
13
15
16
17
18
19
20
14
1
2
3
4
5
6
7
8
9
(1)
ground 1, substrate/leadframe
positive loudspeaker terminal
output channel 2
supply voltage 1
digital input for headphone
sensing
digital trinary input for mode
selection (standby, mute and
operating)
digital trinary input for volume
control channel 1
digital trinary input for volume
control channel 2
supply voltage 2
negative loudspeaker terminal
output channel 2
ground 2, substrate/leadframe
ground 3, substrate/leadframe
positive loudspeaker terminal
output channel 1
supply voltage 3
digital input for gain selection
audio input channel 2
half supply voltage, decoupling
ripple rejection
audio input channel 1
supply voltage 4
negative loudspeaker terminal
output channel 1
ground 4, substrate/leadframe
DESCRIPTION
5
handbook, halfpage
UP/DOWN1
UP/DOWN2
OUT2
OUT2
MODE
GND1
GND2
V DD1
V DD2
HPS
Fig.2 Pin configuration.
TDA8552T; TDA8552TS
10
1
2
3
4
5
6
7
8
9
TDA8552T
MGM610
15
14
13
12
19
18
17
16
11
20
Product specification
GND4
OUT1
V DD4
IN1
SVR
IN2
GAINSEL
V DD3
OUT1
GND3

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