tda8002at/5/c2 NXP Semiconductors, tda8002at/5/c2 Datasheet - Page 21

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tda8002at/5/c2

Manufacturer Part Number
tda8002at/5/c2
Description
Ic Card Interface
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINES
1997 Nov 04
SO28: plastic small outline package; 28 leads; body width 7.5 mm
IC card interface
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT136-1
28
1
Z
max.
2.65
0.10
y
A
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E06
IEC
0.01
0.25
A
3
e
0.019
0.014
0.49
0.36
b
D
p
MS-013AE
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
0.71
0.69
18.1
17.7
D
(1)
0.30
0.29
E
7.6
7.4
(1)
b
p
scale
0.050
EIAJ
1.27
21
5
e
15
14
w
0.419
0.394
10.65
10.00
H
M
E
c
0.055
1.4
L
A
10 mm
2
0.043
0.016
A
1.1
0.4
L
1
p
0.043
0.039
1.1
1.0
Q
H
E
PROJECTION
E
detail X
EUROPEAN
0.25
0.01
v
L
L
0.25
0.01
p
Q
w
(A )
Product specification
3
0.004
0.1
y
A
TDA8002
ISSUE DATE
95-01-24
97-05-22
A
0.035
0.016
Z
0.9
0.4
(1)
X
SOT136-1
v
M
8
0
A
o
o

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