pca9701 NXP Semiconductors, pca9701 Datasheet - Page 4

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pca9701

Manufacturer Part Number
pca9701
Description
Pca9701; Pca9702 18 V Tolerant Spi 16-bit/8-bit Gpi With
Manufacturer
NXP Semiconductors
Datasheet

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Table 2.
[1]
PCA9701_PCA9702_2
Product data sheet
Symbol
SDOUT
INT
INT_EN
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
V
IN8
IN9
IN10
IN11
IN12
IN13
IN14
IN15
CS
SCLK
SDIN
V
SS
DD
HWQFN package die supply ground is connected to both V
for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to
the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be
incorporated in the PCB in the thermal pad region.
Pin description
Pin
SO24, TSSOP24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
6.2 Pin description
HWQFN24 TSSOP16
22
23
24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
[1]
1
2
3
4
5
6
7
9
10
11
12
8
-
-
-
-
-
-
-
-
13
14
15
16
Rev. 02 — 29 August 2007
SS
pin and exposed center pad. V
Type
output
output
input
input
input
input
input
input
input
input
input
ground
input
input
input
input
input
input
input
input
input
input
input
supply
Description
3-state serial data output; normally high-impedance
open-drain interrupt output (active LOW)
interrupt output enable
input port 0
input port 1
input port 2
input port 3
input port 4
input port 5
input port 6
input port 7
ground supply
input port 8
input port 9
input port 10
input port 11
input port 12
input port 13
input port 14
input port 15
chip select (active LOW)
serial input clock
serial data input (20 A pull-down)
supply voltage
1 = interrupt is enabled
0 = interrupt is disabled and high-impedance
18 V tolerant SPI 16-bit/8-bit GPI with INT
PCA9701; PCA9702
SS
pin must be connected to supply ground
© NXP B.V. 2007. All rights reserved.
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