adsp-2191m Analog Devices, Inc., adsp-2191m Datasheet - Page 42

• Manufacturer Part Number: adsp-2191m
• Description: Dsp Microcomputer
• Manufacturer: Analog Devices, Inc.

ADSP-2191M
To ensure that the T
a heatsink and/or an air flow source may be used. A heatsink
should be attached to the ground plane (as close as possible to
the thermal pathways) with a thermal adhesive.
Figure 30. Typical Output Delay or Hold vs. Load
Capacitance (at Maximum Case Temperature)
– 10
30
20
10
0
0
50
AMB
data sheet specification is not exceeded,
LOAD CAPACITANCE – pF
100
150
200
250
–42–
Where:
• T
• PD = Power dissipation in W (this value depends upon
• θ
• For the LQFP package: θ
Table 24.
Airflow
(Linear Ft./Min.)
Airflow
(Meters/Second)
LQFP:
θ
Mini-BGA:
θ
CA
CA
of package)
the specific application; a method for calculating PD is
shown under Power Dissipation).
For the mini-BGA package: θ
CA
AMB
(°C/W)
(°C/W)
= Value from
= Ambient temperature (measured near top surface
θ
CA
Values
T
AMB
Table
0
0
44.3
26
=
T
CASE
24.
JC
= 0.96°C/W
100
0.5
41.4
24
–
JC
PD
= 8.4°C/W
×
200
1
38.5
22
θ
CA
400
2
35.3
20.9
REV. A
600
3
32.1
19.8