mpc8250 Freescale Semiconductor, Inc, mpc8250 Datasheet - Page 44

• Manufacturer Part Number: mpc8250
• Description: Mpc8250 Powerquicc Ii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Pinout
Figure 16
Table 21
Table
44
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
21.
Plated substrate via
shows the pinout list of the MPC8250VR.
shows the side profile of the PBGA package to indicate the direction of the top surface view.
1 mm pitch
Transfer molding compound
Table 21. MPC8250 VR Package Pinout List
Figure 16. Side View of the PBGA Package
Pin Name
MPC8250 Hardware Specifications, Rev. 1
attach
Die
DIE
Ball bond
Table 20
Wire bonds
defines conventions and acronyms used in
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
Freescale Semiconductor
Ball
C16
F11
D2
C1
D1
D5
E8
C4
B4
A4
D7
D8
C6
B5
B6
C7
C8
A6
D9
B7
B8
C9
A7