mpc8314e Freescale Semiconductor, Inc, mpc8314e Datasheet - Page 99

• Manufacturer Part Number: mpc8314e
• Description: Powerquicc Ii Pro Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Table 75. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8314E TEPBGA II
Heat Sink Assuming Thermal Grease
Wakefield, 53 x 53 x 25 mm Pin Fin
Wakefield, 53 x 53 x 25 mm Pin Fin
Wakefield, 53 x 53 x 25 mm Pin Fin
Wakefield, 53 x 53 x 25 mm Pin Fin
AAVID 43 x 41 x 16.5 mm Pin Fin
AAVID 43 x 41 x 16.5 mm Pin Fin
AAVID 43 x 41 x 16.5 mm Pin Fin
AAVID 43 x 41 x 16.5 mm Pin Fin
AAVID 30 x 30 x 9.4 mm Pin Fin
AAVID 30 x 30 x 9.4 mm Pin Fin
AAVID 30 x 30 x 9.4 mm Pin Fin
AAVID 30 x 30 x 9.4 mm Pin Fin
AAVID 35 x 31 x 23 mm Pin Fin
AAVID 35 x 31 x 23 mm Pin Fin
AAVID 35 x 31 x 23 mm Pin Fin
AAVID 35 x 31 x 23 mm Pin Fin
MPC8314E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 0
Natural Convection
Natural Convection
Natural Convection
Natural Convection
Air Flow
0.5 m/s
0.5 m/s
0.5 m/s
0.5 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
603-224-9988
408-749-7601
29 × 29 mm TEBGA II
Junction-to-Ambient
Thermal Resistance
14.4
11.4
10.1
12.3
12.5
10.9
8.9
9.3
8.5
7.9
9.7
8.5
7.7
8.5
7.5
7.1
Thermal (Preliminary)
99