sc18is602 NXP Semiconductors, sc18is602 Datasheet - Page 22
sc18is602
Manufacturer Part Number
sc18is602
Description
Sc18is602/sc18is603 I?c-bus To Spi Bridge
Manufacturer
NXP Semiconductors
Datasheet
1.SC18IS602.pdf
(25 pages)
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NXP Semiconductors
14. Abbreviations
SC18IS602_603_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 16.
Acronym
CDM
CPU
EEPROM
ESD
GPIO
HBM
I/O
I
LSB
MM
MSB
SPI
2
Fig 24. Temperature profiles for large and small components
C-bus
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Charged Device Model
Central Processing Unit
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Input/Output
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Serial Peripheral Interface
Rev. 03 — 13 August 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SC18IS602/603
temperature
peak
I
2
C-bus to SPI bridge
© NXP B.V. 2007. All rights reserved.
001aac844
time
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