isp1106 NXP Semiconductors, isp1106 Datasheet - Page 21

• Manufacturer Part Number: isp1106
• Description: Advanced Universal Serial Bus Transceivers
• Manufacturer: NXP Semiconductors

Philips Semiconductors
15. Additional soldering information
9397 750 08872
Product data
Fig 15. (H)BCC footprint and solder resist mask dimensions.
Cavity: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.
Normal
Corner
Cavity
Terminal
b 2
D h
b
b 1
15.1 (H)BCC packages: footprint
15.2 (H)BCC packages: reflow soldering profile
b 2
E h
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 m min.) ensures
solderability, the Ni layer (5 m min.) prevents diffusion, and the Pd layer on top
(0.5 m min.) ensures effective wire bonding.
The conditions for reflow soldering of (H)BCC packages are as follows:
•
•
•
Preheating time: minimum 90 s at T = 145 to 155 C
Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 C
Peak temperature:
PCB land
– Ambient temperature: T
– Device surface temperature: T
b 2
D h
b
b 1
b 2
E h
Rev. 06 — 30 November 2001
Solder resist mask
0.05
0.05
0.05
amb(max)
0.05
0.05
0.05
case(max)
= 260 C
(4 )
0.1
Stencil mask
0.05
= 255 C.
0.05
ISP1105/1106/1107
0.3 (8 )
0.05
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
0.05
Advanced USB transceivers
Stencil print thickness:
0.1 to 0.12 mm
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
004aaa123
Solder land
Solder resist
Solder stencil
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