hsdl-3007 ETC-unknow, hsdl-3007 Datasheet - Page 11

• Manufacturer Part Number: hsdl-3007
• Description: Irda Data Compliant Low Power 115.2kbit/s With Remote Control Infrared Transceiver
• Manufacturer: ETC-unknow

Appendix A: HSDL-3007 SMT Assembly Application Note
Recommended Metal solder Stencil
Aperture
It is recommended that only a
0.127 mm (0.005 inch) thick
stencil be used for solder
paste printing. This is to
ensure adequate printed solder
paste volume and no shorting.
See the Table 1 below the
drawing for combinations of
metal stencil aperture and
metal stencil thickness that
should be used.
Table 1
Adjacent Land Keepout and Solder
Mask Areas
Adjacent land keepout is the
maximum space occupied by
the unit relative to the land
pattern. There should be no
other SMD components within
this area. The minimum solder
resist strip width required to
avoid solder bridging adjacent
pads is 0.2mm. It is
recommended that two
fiducially crosses be placed at
mid length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
imaginable solder resist/mask
is recommended
11
Stencil
0.127mm
thickness,
t(mm)
1.75±0.05
Length,
Aperture size(mm)
l
0.55±0.05
Width,
w
Solder Pad, Mask and Metal Stencil
Figure 1. Stencil and PCBA
Recommended land pattern
Figure 2. Land Pattern
Figure 3. Solder stencil aperture
Figure 4. Adjacent Land Keepout and Solder Mask Area
1.75
0.10
Stencil
Aperture
Solder
Mask
h
0.55
Apertures As Per
Land Dimensions
SOLDER MASK
MOUNTING
l
CENTER
0.30
j
0.425
0.85
UNITS: mm
k
l
Metal Stencil
For Solder Paste
Printing
Land
Pattern
PCBA
w
Dimension mm
h
k
j
l
FIDUCIAL
+
0.775
t
0.2
3.0
2.6
7.2