hsdl-2100 ETC-unknow, hsdl-2100 Datasheet
hsdl-2100
Available stocks
Related parts for hsdl-2100
hsdl-2100 Summary of contents
Page 1
... General Data Collection Devices – Patient and Pharmaceutical Data Collection • IR LANs Description The HSDL-2100 is a new generation low-cost Infrared (IR) transceiver module that provides the interface between logic and IR signals for through-air, serial, half-duplex IR data links and is compliant to IrDA Physical Layer Specification 1 ...
Page 2
A brief description of the 2 basic sub-assemblies, Optical SubAssembly (OSA) and Electrical SubAssembly (ESA page 2. Applications Information The Applications Engineering group, in the Hewlett-Packard Communications Semiconductor Solutions Division, is available to assist you with the technical ...
Page 3
... Notes environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit. 2. CX1 and CX5 must be placed within 0 the HSDL-2100 to obtain optimum noise immunity. 3. Only necessary in applications where transmitter switching causes more than ripple CX3 may be replaced with 1000 pF for MIR, FIR application performance. For FIR application used 4700 pF as shown in application circuit ...
Page 4
Package Outline with Dimension and Recommended PCBoard Pad Layout (Option #001 — Integrated EMI shield with Guide Pins.) 13.00 ± 0.20 6.30 ± 0.10 TYP. R 0.15 1 0.59 TYP. 0.55 1.143 BSC 0.97 ± 0.10 0.51 ± 0.15 PIN ...
Page 5
Package Outline with Dimension and Recommended PCBoard Pad Layout (Option #002 — Integrated EMI shield without Guide Pins.) 13.00 ± 0.20 TYP TYP. 0.55 1.143 BSC 9.60 ± 0.30 0.97 ± 0.10 0.51 ± 0.15 PIN ...
Page 6
Truth Table Inputs TXD [ [ Don’t care Not Valid Notes: 1. In-Band EI 115.2 Kb/s. 2. In-Band EI 1.15 ...
Page 7
Recommended Operating Conditions Parameter Symbol Operating Temperature T A Supply Voltage V CC Logic High Transmitter V (TXD) IH Input Voltage Logic Low Transmitter V (TXD) IL Input Voltage Logic High Receiver EI Input Irradiance Logic Low Receiver EI Input ...
Page 8
Electrical and Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typical values are at ...
Page 9
... Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may exceed width, which will not affect correct demodulation of the data stream. An ASK and DASK system using the HSDL-2100 has been shown to correctly receive all data bits for 9 W/cm B channel only ...
Page 10
... TYP. 230°C TO 170°C -4°C/s TYP. 170°C TO 25°C -3°C/s MAX. THbd–amb = 50 C/W THbd–amb = 100 C/W THbd–amb = 150 C/W THbd–amb = 200 C/W THbd–amb = 250 C/W THbd–amb = 300 C/W JUNCTION TO CASE MEASUREMENTS FOR HSDL-2100 I (A) MAX. CASE TEMPERATURE (°C) F 0.4 101.3 0.45 98.4 0.5 95.3 ...
Page 11
Tape and Reel Dimensions 16.00 ± 0.10 1.75 ± 0.10 4.88 ± 0.10 Figure 5. Reel for 24 mm Tape REEL FOR 24 mm TAPE DIMENSIONS IN MILLIMETERS Figure 6. 4.00 ± 0.10 LENS FACING DIRECTION 4° MAX. 7.05 ± ...
Page 12
Appendix A. Test Methods A.1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (refer to IEC ...
Page 13
... Appendix B. SMT Assembly Methods 1.0 Solder Pad, Mask and Metal Solder Stencil Adapter STENCIL APERTURE SOLDER MASK Figure 1.0. Stencil and PCB. 1.1. Recommended Land Pattern for HSDL-2100 Dim 2.6 b 0.7 c (pitch) 1.14 d 2.4 e 1.25 f 4.22 g 5.05 Rx LENS 10x PAD Figure 2.0. Top View of Land Pattern. Inches ...
Page 14
Adjacent Land Keepout and Solder Mask Areas Dim min. 0.15 h 13.4 k 7.2 j 2.1 • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no ...
Page 15
... APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS the printed solder paste volume is adequate, the HSDL-2100 will self align after solder reflow. Units should be properly < = 0.2 mm (0.008 inches) 3 degrees 15 2.1. Recommended Metal Solder Stencil Aperture. To ensure adequate printed solder paste volume, the ...
Page 16
Tolerance for X-axis Alignment of Castellation. Misalignment of castellation to the land pad should not exceed 0 approximately half the width of the castellation during placement of the unit. The castellations will completely self- align to the ...