hsdl-3209 ETC-unknow, hsdl-3209 Datasheet
hsdl-3209
Available stocks
Related parts for hsdl-3209
hsdl-3209 Summary of contents
Page 1
... Description The HSDL-3209 is an ultra- small low cost infrared transceiver module that provides the interface between logic and infrared (IR) signals for through air, serial, half- duplex IR data link designed to interface to input/ output logic circuits as low as 1.5V. The module is compliant to IrDA Physical Layer ...
Page 2
... CX2, CX3 Notes: 1. CX1, CX2, CX3 and CX4 must be placed within 0 the HSDL-3209 to obtain optimum noise immunity. CAUTIONS: The CMOS inherent to the design of this component increases the component’s susceptibility to damage from the electrostatic discharge (ESD advised that normal ...
Page 3
Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Storage Temperature Operating Temperature LED Anode Voltage Supply Voltage Input/Output Voltage Input Voltage : SD Input Voltage : TXD DC LED Transmit Current Peak LED ...
Page 4
Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with Vcc set to 3.0V ...
Page 5
V OH 90% 50% 10 Figure 2. RXD output waveform. TXD LED t pw (MAX.) Figure 4. TXD “stuck on” protection waveform. SD TXD TX LIGHT t TW Figure 6. TXD wakeup time waveform. ...
Page 6
... HSDL-3209 Package Outline with Mechanical Dimensions 3.50 7.00 0.95 5.10 R1.10 R1.10 LEDA RXD SD IOVcc Vcc TXD 0.95 ± 0.05 (6x) Notes : 1. ALL DIMENSIONS IN MILLIMETERS (mm). 2. DIMENSION TOLERANCE IS 0.2mm UNLESS OTHERWISE SPECIFIED. 6 Mounting Centre 0.95 PCB solder PCB pad length GND 0.60 ± 0.05 (7x) ...
Page 7
... HSDL-3209 Tape and Reel Dimensions Unit: mm POLARITY Pin 7: GND Pin 1: LEDA 7.35 ± 0.1 0.3 ± 0.05 2.93 ± 0.1 1.78 ± 0.1 Empty Parts Mounted (40mm min) Detail A LABEL 7 4.0 ± 0.1 2.0 ± 0.1 1.5 +0.1 0 4.0 ± 0.1 Progressive Direction Leader (400mm min) Empty (40mm min) Option # "B" "C" Quantity 021 330 ...
Page 8
... Moisture Proof Packaging All HSDL-3209 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Yes No Baking Is Necessary 8 Units in A Sealed Mositure-Proof Package Package Is Opened (Unsealed) Environment less than 30 deg C, and less than 60 Yes ...
Page 9
... The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and HSDL-3209 castellations to change dimensions evenly, putting minimal stresses on the HSDL- 3209 transceiver. 300 ...
Page 10
Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Stencil and PCBA 1.1 Recommended Land Pattern C L Mounting Center 0.10 1.75 0.60 0.95 Unit METAL STENCIL FOR SOLDER ...
Page 11
Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and ...
Page 12
... Appendix B: PCB Layout Suggestion The HSDL 3209 is a shieldless part and hence does not contain a shield trace unlike the other transceivers. The following PCB layout guidelines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part ...
Page 13
... RXD pin. Figure 10 shows how the IrDA port fits into a mobile phone and PDA platform. The link distance testing was done using typical HSDL-3209 units with SMC’s FDC37C669 and FDC37N769 Super I/O controllers. An IrDA link distance was demonstrated ...
Page 14
... Appendix D: Window Designs for HSDL-3209 Optical Port Dimensions for HSDL- 3209 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light ...
Page 15
Aperture Width (X) vs Module Depth Aperture Height(Y) vs Module Depth Window Material Almost any plastic material ...
Page 16
Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be ...