hsdl-3202 ETC-unknow, hsdl-3202 Datasheet - Page 11

• Manufacturer Part Number: hsdl-3202
• Description: Irda Data Power Compliant 115.2 Kb/s Infrared Transceiver
• Manufacturer: ETC-unknow

Pick and Place Misalignment
Tolerance and Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate, the HSDL-3202 will
self-align after solder reflow.
Units should be properly reflowed
in IR/hot air convection oven
using the recommended reflow
profile. The direction of board
travel does not matter.
Direction Definition
Allowable Misalignment
Direction
X
Y
Tolerance for X-axis Alignment of
Castellation
Misalignment of castellation to
the land pad should not exceed
0.2 mm or about one-half the
width of the castellation during
placement of the unit. The
castellations will self-align to the
pads during solder reflow.
11
Tolerance
See text
Y
0.2 mm
3 degrees
X
Tolerance for Rotational ( )
Misalignment
Mounted units should not be
rotated more than
with reference to center X-Y as
shown in the direction definition.
Units that are rotated more than
after solder reflow. Units with
less than a
ment will self-align after solder
reflow.
Y-axis Misalignment of Castellation
In the Y direction, the HSDL-
3202 does not self-align after
solder reflow. Agilent recom-
mends that the part be placed in
line with the fiducial mark (mid-
length of land pad). This will
enable sufficient land length
(minimum of 1/2 land length) to
form a good joint. See the
drawing below.
3 degrees will not self-align
3 degree misalign-
FIDUCIAL
3 degrees
MINIMUM 1/2 THE LENGTH
OF THE LAND PAD
Recommended Solder Paste/Cream
Volume for Castellation Joints
Based on calculation and experi-
ment, the printed solder paste
volume required per castellation
pad is 0.22 cubic mm (based on
either no-clean or aqueous solder
cream types with typically 60% to
65% solid content by volume).
Using the recommended stencil
will result in this volume of solder
paste.
EDGE