sak-cic310-osmx2ht Infineon Technologies Corporation, sak-cic310-osmx2ht Datasheet - Page 65

• Manufacturer Part Number: sak-cic310-osmx2ht
• Description: Flexray Communication Controller
• Manufacturer: Infineon Technologies Corporation

4.4
4.4.1
Table 18
Parameter
Thermal resistance junction case
top
Thermal resistance junction leads
1) The thermal resistances from the case top and the lead to the ambient (
4.4.2
You can find all of our packages, sorts of packing and others in our Infineon Internet
Page “Products”: http://www.infineon.com/products.
Figure 21
Data Sheet
the thermal resistances between the junction and the case/leads given above (
calculate the total thermal resistance between the junction and the ambient (R
The thermal resistances between the case/leads and the ambient (
combination/calculation depend on the external system (PCB, case) characteristics, and are under user
responsibility. The junction temperature can be calculated using the following equation:
where the
resistance
1)
R
Package and Reliability
Package Parameters (PG-TQFP-64)
R
Package Outline
Θ JA
Θ JA
Thermal Characteristics of the Package
Package Outlines PG-TQFP-64, Plastic Green Thin profile Quad Flat
Package
is the total thermal resistance between the junction and the ambient. This total junction ambient
can be obtained from the upper four partial thermal resistances.
1)
Symbol
R
R
θJCTop
θJLeads
66
CC –
CC –
Min. Typ. Max.
Values
R
Θ CTA,
R
SAK-CIC310-OSMX2HT
Θ CTA,
17.1 K/W –
39
R
Θ LA
Θ JA
R
Electrical Parameters
Θ LA
R
).
) as well as the method of
Θ JCTop,
) are to be combined with
Unit Note
K/W –
T
R
J
Θ JLeads
=
V 2.2, 2007-06
Conditions
T
A
+
), in order to
R
IFLEX
Θ JA
×
P
D
,