tea1521t-n2 NXP Semiconductors, tea1521t-n2 Datasheet - Page 10

• Manufacturer Part Number: tea1521t-n2
• Description: Tea152x Family Smps Ics For Low-power Systems
• Manufacturer: NXP Semiconductors

Philips Semiconductors
10. Thermal characteristics
11. Characteristics
TEA152X_FAM_2
Product data sheet
Table 5:
[1]
Table 6:
T
positive when flowing into the IC; unless otherwise specified.
Symbol
R
Symbol
Supply
I
I
I
V
V
I
Pulse width modulator
SOPS
V
t
RC oscillator
V
V
t
f
Duty factor regulator: pin REG
V
G
CC(operate)
CC(startup)
CC(ch)
drain
suppr
RC(ch)
osc
amb
min
max
CC(start)
CC(stop)
demag
RC(min)
RC(max)
REG
th(j-a)
V(erroramp)
Thermal resistance R
printed-circuit board. See the TEA152x application notes for details.
= 25 C; no overtemperature; all voltages are measured with respect to ground; currents are
Parameter
thermal resistance from junction to ambient in free air
Thermal characteristics
Characteristics
DIP8 package
SO14 package
Parameter
supply current
start-up supply current
V
start voltage
stop voltage
supply current drawn from
pin DRAIN
minimum duty factor
maximum duty factor
demagnetization
recognition voltage level
suppression time of
transformer ringing at start
of secondary stroke
minimum voltage of RC
oscillator setting
maximum voltage of RC
oscillator setting
RC charging time
oscillator frequency
input voltage
voltage gain of error
amplifier
CC
pin charging current
th(j-a)
Rev. 02 — 25 January 2006
can be lower when the GND pins are connected to sufficient copper area on the
Conditions
normal operation
start-up
V
undervoltage lock-out
V
f = 100 kHz
drain
drain
no auxiliary supply
with auxiliary supply
> 60 V
> 60 V
Conditions
SMPS ICs for low-power systems
TEA152x family
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Min
-
-
9
7.0
-
-
-
-
50
1.0
60
2.4
-
10
2.4
-
6
Typ
1.3
180
9.5
7.5
1.5
30
0
75
100
1.5
75
2.5
1
100
2.5
20
4
[1]
Typ
100
91
Max
1.9
400
10
8.0
2
125
-
-
150
2.0
90
2.6
-
200
2.6
-
3
Unit
K/W
K/W
10 of 20
Unit
mA
mA
V
V
mA
%
%
mV
mV
V
kHz
V
dB
A
A
s
s