sc14wsmdata Dialog Semiconductor, sc14wsmdata Datasheet - Page 27

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sc14wsmdata

Manufacturer Part Number
sc14wsmdata
Description
Ultra Low Energy Wireless Sensor Module V1.0
Manufacturer
Dialog Semiconductor
Datasheet
© 2011 Dialog Semiconductor B.V/
8.2
Recommended Copper Pad and Solder Mask Opening
(NSMD).
8.3
For the stencil a thickness of 0.122 mm is
recommended. Recommended opening is as shown
below.
COPPER PAD AND SOLDER OPENING
STENCIL
Stencil
Company Confidential
Figure 11 Copper pad and Solder mask opening
Solder Mask
Figure 12 Stencil
27
Opening in stencil 1.40 x 1,40mm
Copper pads
Substrate
0.80x0.80
Preliminary December 4, 2012 v1.0

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