nvt2003 NXP Semiconductors, nvt2003 Datasheet - Page 24
nvt2003
Manufacturer Part Number
nvt2003
Description
Bidirectional Voltage-level Translator For Open-drain And Push-pull Applications
Manufacturer
NXP Semiconductors
Datasheet
1.NVT2003.pdf
(28 pages)
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NXP Semiconductors
15. Abbreviations
NVT2003_04_06
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 12.
Acronym
CDM
ESD
HBM
I
I/O
MM
PRR
RC
2
Fig 23. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Input/Output
Machine Model
Pulse Repetition Rate
Resistor-Capacitor network
Rev. 2 — 29 March 2011
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Bidirectional voltage-level translator
NVT2003/04/06
temperature
peak
© NXP B.V. 2011. All rights reserved.
001aac844
time
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