at24c16c-xhm-t ATMEL Corporation, at24c16c-xhm-t Datasheet - Page 15

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at24c16c-xhm-t

Manufacturer Part Number
at24c16c-xhm-t
Description
Two-wire Serial Electrically Erasable And Programmable Read-only Memory
Manufacturer
ATMEL Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C16C-XHM-T
Manufacturer:
ATMEL
Quantity:
2 456
Part Number:
AT24C16C-XHM-T
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
8719A–SEEPR–9/10
9.
Ordering Codes
Atmel AT24C16C Ordering Information
Notes:
Ordering Codes
AT24C16C-PUM (Bulk Form Only)
AT24C16C-SSHM-B
AT24C16C-SSHM-T
AT24C16C-XHM-B
AT24C16C-XHM-T
AT24C16C-MAHM-T
AT24C16C-MEHM-T
AT24C16C-STUM-T
AT24C16C-CUM-T
AT24C16C-WWU11M
8P3
8S1
8A2
8Y6
8ME1
5TS1
8U3-1
1. "-B" denotes bulk delivery
2. "-T" denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23, and VFBGA = 5K/reel
3. For Wafer sales, please contact Atmel Sales
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN)
8-lead, 1.80mm x 2.20mm Body, (XDFN)
5-lead, 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT-23)
8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
(2)
(1)
(2)
(2)
(2)
(1)
(2)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(matte Sn)
(3)
(matte Sn)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
Voltage
Die Sales
Package
8U3-1
8ME1
5TS1
8P3
8S1
8S1
8A2
8A2
8Y6
Atmel AT24C16C
Lead-Free/Halogen-Free
Industrial Temperature
Industrial Temperature
Operating Range
(-40°C to 85°C)
(-40°C to 85°C)
15

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