m24c32-wmn3p STMicroelectronics, m24c32-wmn3p Datasheet - Page 30
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m24c32-wmn3p
Manufacturer Part Number
m24c32-wmn3p
Description
Kbit, Kbit Kbit Serial Eeprom
Manufacturer
STMicroelectronics
Datasheet
1.M24C32-WMN3P.pdf
(34 pages)
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Package mechanical
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Figure 16. UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pitch Dual Flat Package No lead
1. Drawing is not to scale.
Table 22.
Symbol
ddd
A1
D2
E2
L1
L3
A
D
E
b
e
L
2 × 3mm, package outline
UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2 × 3mm, package mechanical data
A
0.55
0.02
0.25
2.00
1.60
3.00
0.20
0.50
0.45
Typ
E
A1
millimeters
0.50
0.00
0.20
1.90
1.50
2.90
0.10
0.40
0.30
Min
D
–
Max
0.60
0.05
0.30
2.10
1.70
0.08
3.10
0.30
0.50
0.15
ddd
–
L3
0.022
0.001
0.010
0.079
0.063
0.118
0.008
0.020
0.018
Typ
D2
e
M24128, M24C64, M24C32
b
inches
0.020
0.000
0.008
0.075
0.059
0.114
0.004
0.016
0.012
UFDFPN-01
Min
–
L1
E2
L
0.024
0.002
0.012
0.083
0.067
0.003
0.122
0.012
0.020
0.006
Max
–
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